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HBM is the memory of choice for top AI accelerators, sold by only a few makers like SK Hynix, Samsung, and Micron.
HBM reaches its huge bandwidth by stacking several memory chips vertically on top of each other and connecting them with tiny vertical wires called through-silicon vias, creating an extremely wide, short data path right next to the processor rather than spreading memory out flat across a circuit board.
Running a single chip at higher voltage would increase power draw and heat, not fundamentally change how much data can move at once, so it isn't the source of HBM's bandwidth advantage. Spreading chips across the motherboard is essentially the opposite approach, the traditional flat layout HBM was designed to replace.
Because HBM's 3D stacking is so complex to manufacture, it is currently produced by only a handful of companies worldwide, which has made it one of the tightest supply bottlenecks in the booming market for AI accelerator chips.
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